X-ray and CSAM inspection for failure analysis


Cupio will be exhibiting at Southern Manufacturing & Electronics (stand B110) with team members available to discuss any aspect of test or failure analysis. 

Failure modes such as delamination, voiding or solder bridging cannot be easily seen as they occur internally – yet opening the failed product may be impractical, or destroy the fault evidence.

Accordingly, non-destructive inspection methods that generate high-resolution fault images are essential for failure analysis.

Two complementary approaches exist: X-ray inspection and Confocal Scanning Acoustic Microscopy (CSAM). Broadly, CSAM reveals air gaps, voids, and delamination in materials that X-Ray cannot see; for example, delamination in a circuit board would be invisible to X-Ray but easily seen in CSAM. Conversely, BGA ball voids are difficult to visualise with CSAM but easy with X-Ray.

Available from Cupio, the Nordson Dage GEN7 is a good example of a CSAM system. It offers one of the best ways of finding delamination and voiding faults, as well as structural and material problems. It can scan anything from a small part to a large 350mm wafer chuck. With five independent motors, it offers six times the acquisition rate of earlier models, with 23% more scanning area to accommodate larger samples.

The Nordson Dage QUADRA 7 is an advanced X-ray inspection machine which provides 2D, CT and tomosynthesis X-ray modes; it has built-in tomosynthesis with a quick change to CT. It supports high-resolution imaging with a 4k image of 100nm resolution.

The QUADRA 7’s industry-leading Aspire FP detector captures 6.7MP images at 30fps. These images are shown on two 4K UHD monitors, as conventional HD monitors lack the resolution needed to show them.

Cost-effective access to both technologies is available without the need to buy capital equipment, by using an inspection and test house like Cupio. The company always has the latest equipment, backed by deep expertise in both technologies and how to apply them.



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