InfraTec E-LIT – Lock-In Thermography for Electronics is an automated testing solution system (as part of NDT techniques) which allows non-contact (electrical) failure analysis of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss, leakage currents, resistive vias, cold joints, latch-up effects and soldering issues can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure.
Smallest defects at electronic components like point and line shunts, issues from overheating, internal (ohmic) shorts, oxide defects, transistor and diode failures on a PCB surface, in integrated circuits (IC´s), LED modules and battery cells can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.
E-LIT is extremely powerful in resolving smallest geometrical structures as it can be equipped with strong microscopic lenses and additional SIL lenses. Identifying smallest structures with E-LIT does not mean that the resulting field of view will also be smallest – implementing thermal cameras with detector sizes of up to (1,920 x 1,536) pixels provides large scale microscopic imaging. For even larger imaging stitching options are available.
To learn more about E-Lit and applications, please visit qd-uki.co.uk